Ceramic lids: Evaluation report
Abstract
Utilization of hybrid substrate package styles and protection of the circuit by a lid hermetically sealed to the substrate were evaluated. Properties, quoted in the literature, are confirmed for this type of packaging. Good results in respect to microleaks are obtained. This packaging meets military requirements (- 55 C to + 175 C). It is recommended that further work be undertaken in order to reduce humidity inside the package on closing.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- December 1981
- Bibcode:
- 1981STIN...8311455J
- Keywords:
-
- Ceramics;
- Coverings;
- Electronic Packaging;
- Technology Assessment;
- Electronic Equipment Tests;
- Environmental Tests;
- Hermetic Seals;
- Sealers;
- Sealing;
- Substrates;
- Electronics and Electrical Engineering