Manufacturing methods and technology engineering for tape chip carrier

This contract was aimed at establishing the feasibility of an assembly line for manufacturing hybrid microcircuits using tape automated bonding (TAB). This report describes work performed during the pilot line phase of the contract. A purpose of the MM&T work was to demonstrate the viability of the manufacturing approaches with TAB and the determination of the associated yield and cost factors. This report includes an overview of these factors, the methods and equipment employed in the manufacture of approximately 1200 hybrid microcircuits with TAB, and the qualification test results of the circuits using the TAB mounted devices.