LCCs in hybrids
Abstract
The application of leadless chip carrier (LCC) technology in hybrids is discussed. The advantages of LCCs with respect to dual in-line packages and bare semi-conductor chips are examined, and techniques for assembling hybrids incorporating LCCs are outlined. Special attention is given to the compatibility of LCC attach methods with other hybrid processing steps.
- Publication:
-
Military Electronics Countermeasures
- Pub Date:
- June 1981
- Bibcode:
- 1981MiElC...7...43M
- Keywords:
-
- Chips (Electronics);
- Electronic Packaging;
- Hybrid Circuits;
- Integrated Circuits;
- Semiconductor Devices;
- Assembling;
- Circuit Boards;
- Circuit Reliability;
- Military Technology;
- Substrates;
- Systems Compatibility;
- Technology Utilization;
- Electronics and Electrical Engineering