Microcircuit reliability characterization

A methodology for the reliability characterization of microcircuits is discussed with particular reference to the reliability physics approach. This approach is based on the development of a thorough understanding of the basic failure mechanisms of these devices and includes physical part base-lining or product analysis, laboratory accelerated testing, and subsequent failure analysis of resulting failures. Typical failure mechanisms are examined as well as test instrumentation used, such as the scanning electron microscope and mass spectrometer. The evolution of microcircuit technology and the need for complex failure analysis tools and procedures for microprocessors and large scale integrated circuits are reviewed, and the concept of reverse engineering for LSIs is presented.