Development of glass encapsulation techniques for terrestrial photovoltaic arrays
Abstract
Two parallel development programs for terrestrial solar cell module encapsulation and fabrication are reviewed, including the status of electrostatic bonding as an encapsulation technique. Current designs of electrostatically bonded modules are discussed, fabrication of which is now routine. The design of a high-efficiency module is presented, for which performance reliability features are discussed. This design is compatible with later generation changes such as the introduction of encapsulation by electrostatic bonding. Application of wire mesh contacts by electrostatic bonding has resulted in I-V curve fill factors of 0.74. Cell designs that would allow existing Pyrex glass to be used in electrostatically bonded modules are presented.
- Publication:
-
14th Photovoltaic Specialists Conference
- Pub Date:
- 1980
- Bibcode:
- 1980pvsp.conf..965Y
- Keywords:
-
- Electrostatic Bonding;
- Encapsulating;
- Energy Conversion Efficiency;
- Photovoltaic Cells;
- Solar Arrays;
- Volt-Ampere Characteristics;
- Design Analysis;
- Electronic Modules;
- Energy Technology;
- Environmental Tests;
- Glass;
- Reliability Engineering;
- Solar Cells;
- Engineering (General)