Integrated-circuit fabrication flaw detected using the supply-current analysis technique
Abstract
The supply-current analysis technique has exposed an internal fabrication defect in a TTL bipolar integrated circuit which was neither a functional nor a parametric failure. This flaw gives rise to localized heating and provides a load on the pull-up transistor which is in excess of its rating. Thus the supply-current analysis (Scan) technique provides a valid quality assurance screen for TTL bipolar integrated circuits.
- Publication:
-
Electronics Letters
- Pub Date:
- November 1979
- DOI:
- 10.1049/el:19790533
- Bibcode:
- 1979ElL....15..745R
- Keywords:
-
- Defects;
- Electrical Faults;
- Electronic Equipment Tests;
- Integrated Circuits;
- Scanning;
- Electronics and Electrical Engineering