Critique of the centrifuge as a stressing device
Abstract
The results of this study provide mathematical relationships to theoretically assess the capabilities of the centrifuge test as a stressing device for the following microelectronic components: wires and wire bonds, chip and substrate attachment, lids and bases of rectangular flat-packs. The results of the study suggest that the centrifuge is of marginal utility as a stressing device for the above mentioned components.
- Publication:
-
Final Technical Report Syracuse Univ
- Pub Date:
- May 1978
- Bibcode:
- 1978syra.rept.....L
- Keywords:
-
- Analysis (Mathematics);
- Centrifugal Force;
- Microelectronics;
- Chips (Electronics);
- Electronic Packaging;
- Stress Analysis;
- Wire;
- Electronics and Electrical Engineering