Accelerated reliability evaluation of trimetal integrated circuit chips in plastic packages
Abstract
Accelerated step stress and constant-stress reliability tests have been performed on trimetal MOS and bipolar IC chips wire-and-beam-tape bonded in both plastic and hermetic packages. A failure mechanism related to a high-temperature chemical reaction between the epoxy molding compound and the materials of the device support structure was identified and a solution provided.
- Publication:
-
Reliability Physics 1978
- Pub Date:
- 1978
- Bibcode:
- 1978reph.proc..224G
- Keywords:
-
- Accelerated Life Tests;
- Chips (Electronics);
- Circuit Reliability;
- Failure Modes;
- Integrated Circuits;
- Metal Oxide Semiconductors;
- Chemical Reactions;
- Electronic Packaging;
- Epoxy Resins;
- High Temperature Tests;
- Molding Materials;
- Plastics;
- Reliability Analysis;
- Electronics and Electrical Engineering