Electronic Components Conference, 28th, Anaheim, Calif., April 24-26, 1978, Proceedings
Abstract
Topics related to reliability, thick film materials, YAG laser applications, and connector technology are discussed, taking into account contaminant induced aging in integrated circuit packages, thermal compression bonding failures due to incomplete sintering of aluminum oxide, a high performance thick film capacitor system, a thick film capacitative temperature sensor, YAG laser cutting of C-axis sapphire, a field study of the electrical performance of separable connectors, and low cost connectors for single optical fibers. Other areas considered include beam and bump chip joining, ceramic capacitors, materials for hybrid microcircuits, hybrid applications, nondestructive testing, in process testing and control, and bonding technology.
- Publication:
-
EASCON 1978; Electronics and Aerospace Systems Convention
- Pub Date:
- 1978
- Bibcode:
- 1978ieee.confQ.....
- Keywords:
-
- Components;
- Conferences;
- Electrical Engineering;
- Electronic Equipment;
- Bonding;
- Capacitors;
- Chips (Electronics);
- Component Reliability;
- Electric Connectors;
- Microelectronics;
- Nondestructive Tests;
- Optical Fibers;
- P-I-N Junctions;
- Process Control (Industry);
- Thick Films;
- Yag Lasers;
- Electronics and Electrical Engineering