Improved methods of fabricating multilayer printed wiring boards
Abstract
A reliable process for the fabrication of multilayer printed wiring boards was improved by implementing a solder-dip-and-level process in place of the conventional pattern-tin-lead-plate process. An economical, disposable polyvinyl fluoride film release sheet was adopted, and a nuclear static electricity eliminator was effective in providing lint free panels.
- Publication:
-
Final Report Bendix Corp
- Pub Date:
- January 1978
- Bibcode:
- 1978bend.rept.....W
- Keywords:
-
- Circuit Boards;
- Electrical Engineering;
- Printed Circuits;
- Soldering;
- Integrated Circuits;
- Metal-Metal Bonding;
- Static Electricity;
- Vinyl Polymers;
- Electronics and Electrical Engineering