The capability to hermetically seal hybrid microcircuits was established. Tests indicate that helium fine leak rates in the low 10 to the 8th power cu cm/s region and moisture content of less than 500 ppm are obtained with the 80 percent gold-20 percent tin solder sealing process being used. Initial production results indicate a yield of better than 90 percent for the process.
NASA STI/Recon Technical Report N
- Pub Date:
- December 1978
- Hermetic Seals;
- Hybrid Circuits;
- Electronic Packaging;
- Electronics and Electrical Engineering