Reproducible adhesion test for soldered thick-film conductors
Abstract
The need for an adhesion test method that is more reproducible from operator to operator and from laboratory to laboratory is well known in the thick-film industry. The development of such a method was begun at RCA under earlier Naval contracts, and has been completed and tested in detail in this study. Thorough descriptions of two recommended variations of the method, the apparatus required to perform them, and the evaluations made during this study are presented.
- Publication:
-
Final Report
- Pub Date:
- July 1977
- Bibcode:
- 1977rca..reptS....H
- Keywords:
-
- Adhesion;
- Electric Conductors;
- Metal Films;
- Solders;
- Data Acquisition;
- Gold;
- Palladium;
- Peeling;
- Platinum;
- Silver;
- Thick Films;
- Electronics and Electrical Engineering