Investigation of package sealing using organic adhesives
Abstract
A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.
- Publication:
-
1977 NASA/ISHM Microelectronics Conference
- Pub Date:
- November 1977
- Bibcode:
- 1977ishm.conf...77P
- Keywords:
-
- Adhesives;
- Electronic Packaging;
- Hermetic Seals;
- Component Reliability;
- Environmental Tests;
- Humidity;
- Sealing;
- Temperature Effects;
- Thermal Shock;
- Communications and Radar