Integrated circuit electromagnetic susceptibility investigation, phase 3

This document reports the progress made in investigations of the susceptibility of integrated circuits (ICs) to microwave energy. This report covers work performed in the second of three increments of the IC susceptibility task. The microwave effects on semiconductor integrated circuits have been studied, and susceptibility mechanisms for pn junctions and transistors have been identified and modeled. The modeling effort expanded to include the use of circuit analysis program, SPICE (Simulation Program with Integrated Circuit Emphasis), in determining effects of microwave signal in ICs. Testing has been performed to provide data for this interference modeling. Also in the second increment a study of IC failure mechanisms due to RF has been performed. This study includes an extensive testing program and generation of a failure model for each observed failure. The changes to the first draft of the IC susceptibility handbook and the rationale behind the changes are also included in this report.