Manufacturing methods and technology engineering for tape chip carrier

The purpose of this program is to demonstrate the concept of an automated assembly line for hybrid microcircuits, through the establishment of techniques for tape carrier mounting of semiconductor chips, burn-in and testing of these chips on tape and their placement into representative hybrid circuits. The Tape Chip Carrier (TCC) system permits mounting of semiconductor chips on reels of sprocketed film. The system is an established means of automating the interconnection of individually packaged semiconductor chip devices. It has been adapted to the fabrication of hybrid microcircuits used in the manufacture of certain commercial computers. Its overall adaptation to the hybrid microcircuit industry is expected to be greatly enhanced by this program. The automated assembly line will make use of an automatic feed mechanism at each process step, and magazines to transport substrates and partially assembled circuits between process points.