Solderability testing of microcircuits
Abstract
Solderability tests were performed on Fe-Ni-Co and Fe-Ni microelectronic lead base materials with surface preparations as required by MIL-M-38510C. Test samples were used from four different sources. The solderability tests included MIL-STD-883A, Meniscograph and Hot Iron methods. Sample data from the three test methods showed good correlation. Microelectronic lead aging studies showed that the current steam aging environment should be retained.
- Publication:
-
Final Technical Report
- Pub Date:
- May 1977
- Bibcode:
- 1977gec..reptR....O
- Keywords:
-
- Microelectronics;
- Soldering;
- Solders;
- Aging (Materials);
- Cobalt Alloys;
- Iron Alloys;
- Nickel Alloys;
- Electronics and Electrical Engineering