This essay deals with a part of solderless connection technology. Preference is given to those technologies which undoubtedly represent pioneering achievements in the field of modern connection technology. This essay was written in order to help the younger generation in the profession to obtain a firm theoretical basis for any practical experience. Major topics addressed are: (1) the compression or pressing method (crimped joints); and (2) wire wrap connections.
NASA STI/Recon Technical Report N
- Pub Date:
- July 1977
- Joints (Junctions);
- Pressing (Forming);
- Technology Assessment;
- Electronics and Electrical Engineering