Hybrid integrated circuits: A survey
Abstract
Two proximity fuzes under development at the Harry Diamond Laboratories use thick-film hybrid integrated circuits. A survey of the hybrid integrated circuit industry was conducted to determine its capability to produce these circuits in volume within the continental United States. The circuits as complex as those used in XM587 and XM734 fuzes are in volume production using certain types of automation.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- January 1977
- Bibcode:
- 1977STIN...7727317I
- Keywords:
-
- Hybrid Circuits;
- Integrated Circuits;
- Production Engineering;
- Technology Assessment;
- Thick Films;
- Electronics and Electrical Engineering