DC thermal model of semiconductor device produces current filaments as stable current distributions

A simple two-dimensional thermal model is devised to facilitate the study of current filaments in semiconductor devices. The dc model generates temperature and current distributions across the semiconductor chip, and produces current filaments as stable current distributions. The model indicates that current filaments will form in avalanche diodes at high power levels even when chips are unflawed. Increase of dc conductance with temperature at some operating point is crucial. Current filament behavior in avalanche conduction and RF-induced burnout of avalanche diodes were simulated with the model.