Characterization of the thermosonic wire bonding technique
Abstract
The contribution of the thermosonic bonding technique to solid phase bonds on both thin film metallized substrates and thick film metallized component terminations was evaluated. The experimental materials and procedures, the bonding parameters, and the test results are presented. The thermosonic bonding process is capable of producing fine wire gold bonds to a variety of thin and thick film metallized surfaces. These bonds exhibited excellent metal to metal adherence and high tensile strengths.
- Publication:
-
Presented at Intern. Microelectronics Symp
- Pub Date:
- 1976
- Bibcode:
- 1976inmi.symp.....J
- Keywords:
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- Metal-Metal Bonding;
- Solid Phases;
- Thermal Stresses;
- Wire;
- Microelectronics;
- Thick Films;
- Thin Films;
- Ultrasonic Soldering;
- Electronics and Electrical Engineering