Device/packaging reliability problems of solid-state devices for space applications
Abstract
This paper presents data that has been generated within NASA, especially the Marshall Space Flight Center, concerning several failure mechanisms that have occurred with microelectronic packages. The types of packages that will be discussed are primarily flat packs with 14-24 exit leads that are composed of Kovar electro-deposited nickel and finally gold plated.
- Publication:
-
EASCON 1976; Electronics and Aerospace Systems Convention
- Pub Date:
- 1976
- Bibcode:
- 1976easc.conf..145V
- Keywords:
-
- Environmental Tests;
- Hermetic Seals;
- Integrated Circuits;
- Microelectronics;
- Reliability Engineering;
- Aerospace Environments;
- Conductive Heat Transfer;
- Cracking (Fracturing);
- Failure Analysis;
- Stress Corrosion Cracking;
- Thermal Cycling Tests;
- Electronics and Electrical Engineering