Methods for testing high voltage connectors in vacuum, measurements of thermal stresses in encapsulated assemblies, and measurement of dielectric strength of electrodes in encapsulants versus radius of curvature

Internal embedment stress measurements were performed, using tiny ferrite core transformers, whose voltage output was calibrated versus pressure by the manufacturer. Comparative internal strain measurements were made by attaching conventional strain gages to the same type of resistors and encapsulating these in various potting compounds. Both types of determinations were carried out while temperature cycling from 77 C to -50 C.