Composite cure studies by dielectric and calorimetric analyses
Abstract
A description is presented of the experimental results obtained in the studies of three systems. The approaches of dynamic dielectric analysis and differential scanning calorimetry were used in the investigations. The three systems considered include a typical 350 F epoxy advanced composite matrix, a G-11 circuit board system, and an addition and a condensation polyimide.
- Publication:
-
Bicentennial of Materials Progress
- Pub Date:
- 1976
- Bibcode:
- 1976bmp..proc..803M
- Keywords:
-
- Composite Materials;
- Curing;
- Dielectrics;
- Heat Measurement;
- Thermosetting Resins;
- Calorimeters;
- Dynamic Structural Analysis;
- Fabrication;
- Polyimide Resins;
- Time Response;
- Instrumentation and Photography