Laser contoured and drilled substrates for thick film applications
Abstract
The feasibility of using laser contoured and drilled substrates for thick film circuits was demonstrated. Laser contouring and drilling was found to provide the dimensional accuracy required, and the finished product was proven capable of withstanding the thermal stresses imposed by thermal shock tests conducted.
- Publication:
-
Final Report Bendix Corp
- Pub Date:
- September 1976
- Bibcode:
- 1976bend.rept.....U
- Keywords:
-
- Laser Drilling;
- Substrates;
- Thick Films;
- Circuit Reliability;
- Shock Tests;
- Thermal Shock;
- Thermal Stresses;
- Lasers and Masers