Production of printed circuits: On the problem of the etch dressing in the semiadditive technique and the question of pre-etched base material

The problem of etch dressing is addressed and the questions as to the specific problems of the pre-etched material. The material, the surface of which was already prepared by the laminate manufacturer for copper deposition, and hence was introduced directly by the conductor-board producer into the wet-chemical line as copper backed base material, was considered.