Production of printed circuits: On the problem of the etch dressing in the semiadditive technique and the question of pre-etched base material
Abstract
The problem of etch dressing is addressed and the questions as to the specific problems of the pre-etched material. The material, the surface of which was already prepared by the laminate manufacturer for copper deposition, and hence was introduced directly by the conductor-board producer into the wet-chemical line as copper backed base material, was considered.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- December 1976
- Bibcode:
- 1976STIN...7724376F
- Keywords:
-
- Additives;
- Adhesion Tests;
- Etching;
- Printed Circuits;
- Chemisorption;
- Cratering;
- Metallography;
- Surface Defects;
- Electronics and Electrical Engineering