Additive process for the production of printed circuit boards
Abstract
Introduction of the additive process offers new prospects for the production of printed circuit boards. The process described is best designated semi-additive, as about 5 micrometers of copper is first applied to the entire surface of the board and the circuit is then formed by etching of the superfluous copper film. In the purely additive process etching is not used: the circuit is produced by optical sensitization even before the chemical copper is deposited.
- Publication:
-
NASA STI/Recon Technical Report N
- Pub Date:
- February 1976
- Bibcode:
- 1976STIN...7623477E
- Keywords:
-
- Circuit Boards;
- Printed Circuits;
- Addition;
- Conduction;
- Copper;
- Cost Analysis;
- Fineness;
- Plastics;
- Production Engineering;
- Subtraction;
- Tolerances (Mechanics);
- Electronics and Electrical Engineering