A microcircuit on a thermostated substrate
Abstract
Results of experiments geared to the design of a hybrid integrated circuit on a thermostable substrate to facilitate control of temperature drift of circuit parameters is described. Excellent thermal contact is maintained with either active or passive circuit elements. Metallic substrate and cover constitute the microcircuit body, and a sitall (pyroceramic or glass-ceramic composite) chip is bonded to the substrate. Temperature drift of FET microcircuit parameters was successfully countered, a temperature damping factor of 500 was attained, and the method shows promise of great versatility in application to microcircuits of different types, including operational amplifier microcircuits.
- Publication:
-
Mikroelektronika
- Pub Date:
- April 1976
- Bibcode:
- 1976Mikro...5..200O
- Keywords:
-
- Hybrid Circuits;
- Integrated Circuits;
- Microelectronics;
- Network Synthesis;
- Circuit Diagrams;
- Field Effect Transistors;
- Substrates;
- Thermal Stability;
- Transistor Circuits;
- Electronics and Electrical Engineering