Manufacturing methods and technology program for beam lead sealed junction semiconductor devices
Abstract
The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. A detailed evaluation is included on most devices not discussed in the First Quarterly Report. The status of all devices presently in design or processing is reviewed.
- Publication:
-
Quarterly Progress Report
- Pub Date:
- November 1975
- Bibcode:
- 1975moto.reptR....P
- Keywords:
-
- Beam Leads;
- Joints (Junctions);
- Semiconductor Devices;
- Ttl Integrated Circuits;
- Avalanche Diodes;
- Junction Transistors;
- Sealing;
- Semiconductor Junctions;
- Electronics and Electrical Engineering