The relationship between reliability and bonding techniques in hybrid systems
Abstract
Differential thermal expansion has been shown to be responsible for many observed failures in ceramic chip capacitors mounted on alumina substrates. The present work has shown that the mounting techniques used in bonding the capacitors have a marked effect upon the thermally induced mechanical stress and thus the failure rate. A mathematical analysis of a composite model of the capacitor-substrate system to predict the magnitude of thermally induced stresses have been conducted. It has been experimentally observed that the stresses in more compliant bonding systems such as soft lead/tin and indium solders are significantly lower than those in hard solder and epoxy systems. From the data obtained, several recommendations are made concerning the optimum bonding system for the achievement of maximum reliability.
- Publication:
-
IEEE Transactions on Parts Hybrids and Packaging
- Pub Date:
- September 1975
- Bibcode:
- 1975ITPHP..11..195K
- Keywords:
-
- Capacitors;
- Ceramic Bonding;
- Circuit Reliability;
- Hybrid Circuits;
- Soldered Joints;
- Thermal Stresses;
- Aluminum Oxides;
- Electrical Faults;
- Failure Analysis;
- Reliability Analysis;
- Stress-Strain Diagrams;
- Substrates;
- Temperature Effects;
- Thermal Expansion;
- Time Dependence;
- Electronics and Electrical Engineering