A micro contact spider for the testing of wafers in integrated circuits

In currently used devices for the testing of individual components in the production of integrated circuits contact with the metal films on the pellets is established by means of fine needles. Certain difficulties related to the employment of such needles are discussed. These difficulties can be overcome with the aid of a device which has an arrangement of contact areas that corresponds to the pattern of contact pads on the pellet. Questions concerning the design and the technology of such a device are considered along with the results of experiments which show the feasibility of the described approach.