Production engineering measure for hybrid integrated circuits for fuze applications. Volume 2: Precision oscillator integrated circuit

Breadboard circuit construction showed a need for certain changes to the specifications in regard to component selection. Initial construction of the devices was accomplished with two thin film bonded substrates. This was later changed to a single substrate. A continued series of circuit design problems made it necessary to revise the Specifications in regard to circuit topology and component selection. Failure to pass 30 Kg force in tests required units to be foam filled. A total of 1903 oscillators were made in the Pilot Run.