An informative description is presented of the most common failure mechanisms which occur in monolithic integrated circuits, particularly in plastic encapsulated components. There is also a brief description of the precautions already being applied, or those which can be applied by the IC producers to reduce the rate and extent of failures. Circuit types to which these improvements can be applied most advantageously are given.
NASA STI/Recon Technical Report N
- Pub Date:
- September 1974
- Failure Analysis;
- Integrated Circuits;
- Production Engineering;
- Electronics and Electrical Engineering