RF hybrid microcircuit soldering techniques

Progress on the development of hybrid microcircuit technology is described. To minimize the inductance caused by flying wires it was desirable to attach most applique parts to the hybrid circuits using a solder alloy. The hybrid circuits have 60 kA of gold as the metallization to which the applique parts are attached. The solder development activities, equipment, and assembly techniques using a 50%, by weight, lead-indium solder alloy are described.