The technology of microwave integrated circuits
Abstract
Monolithic and hybrid technologies are considered and a description is given of the properties of high resistivity semiconducting substrates. Questions of thin-film technology are examined, taking into account metal requirements, the deposition of metals and conductor fabrication, metal combinations for multilayer deposited conductors, interactions in multilayer thin-film metal conductors, and losses in two-layer and in three-layer metal systems. Aspects of thick-film technology are also discussed along with the characterization and incorporation of active devices in MICs. Attention is given to circuit requirements and fabrication.
- Publication:
-
In: Advances in microwaves. Volume 8. (A75-34337 16-33) New York
- Pub Date:
- 1974
- Bibcode:
- 1974AdMi....8...11S
- Keywords:
-
- Hybrid Circuits;
- Integrated Circuits;
- Metal Films;
- Microwave Circuits;
- Technology Assessment;
- Thin Films;
- Avalanche Diodes;
- Electrical Resistivity;
- Fabrication;
- Gallium Arsenides;
- Metallizing;
- Semiconductor Devices;
- Substrates;
- Technology Utilization;
- Thick Films;
- Electronics and Electrical Engineering