Some properties of vacuum-deposited films of aluminum, nickel, cobalt, copper, and Cu-Cr-Al alloy
Abstract
An investigation has been made of the electrical and adhesional properties, thermal stability, brazeability, and structure of vacuum-deposited films of aluminum, nickel, cobalt, copper, and a copper-based alloy containing 2.45 wt.% Cr, 4.89 wt.% Al. It was shown that the resistivity of pure metal films is greater than that of the original massive sample. The resistivity of films based on the alloy of the investigated composition is less than that of the original material. The introduction into the original alloy of Cr and Al as alloying elements facilitates reduction of the grain size D and of the height H of the surface microirregularities of the films by comparison with the same parameters for copper-based thin films. Alloying of the original alloy with chromium and aluminum makes possible a substantial improvement in the adhesion of the films to the plastic-laminate substrate and increase in the thermal stability of the alloy-based film elements. Recommendations are made for the practical application of the results.
- Publication:
-
Soviet Physics Journal
- Pub Date:
- August 1971
- DOI:
- 10.1007/BF00820067
- Bibcode:
- 1971SvPhJ..14.1060B